HADI, MULYO PUJI (2006) PENINGKATAN KUALITAS DENGAN METODE DEFINE-MEASURE-ANALYZE-IMPROVE-CONTROL (DMAIC) PADA PROSES PRODUKSI RF ANTENNA SWITCH MODULE (LTCC) DI PT. PANASONIC ELECTRONIC DIVICES INDONESIA.LTD. S1 thesis, Universitas Mercu Buana Jakarta.
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Abstract
Nowadays at globalization era customer having a big change, even on they needs and how they fill up they needs. Consument take the control, it make produsen keep trying to produce the product exactly same like customer needs. PT. Panasonic Electronic Divices Indonesia Ltd.enterprises produce electronic components which almost 70% sale with export oriented, they have a though competition for having tha market. That is the way PT. Panasonic Electronic Divices Indonesia Ltd make electronic components with high quality to complete customer needs and wants. Doing with this thing company can get the profit and with the competition. Data entry from define which is where the diagram for flow diagram processing choosing process with the accurate and make diagram for input output. At the measurement step, the choosing characteristic (CTQ) making map control also counting process capability and company sigma level at the same time. All data on stabil condition . The next step is analyzing step, at the step we make fishbone, QA Matrik & Failure Tree Analysis (FTA) to do identification and analysation where the mistake is. To improve step at this level, we do the planning for company, at this step also given the solution to doing the right things base on where the mistake is. From the data entry, we know that most mistake for antenna switching module product is NG Electrical, but to improve so difficult and need review to change product design. Item defect/NG in 2nd is NG Sheet Cutting ~ Barrel equal to 27.07%. NG Sheet Cutting ~ Barrel translated again in pareto diagram which have dominant item defect is NG Layer, but after NG Layer translated with detail , get the more dominant item defect is NG Warping (Lengkung) equal to 24.4%, hence for the research becoming focus of research is NG Warping (Lengkung). There are 3 CTQ at layering process (item warping) , that is thick layer, really warping and thick electrode. Company sigma level is 4.1 sigma. From identification and analysis we found so many factor which make the mistake from human mistake methode and environment, machine and the equipment which been using. For that reason making a plan to solve the problem base on many factor which making the mistake. The good Quality will get succed if we do as the plan and also we must fixed all factor. They given some suggestion for company at standart operating procedures (SOP).
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